California SiC factory funding; IEDM announcements, including 2nm and 2D materials advances from Intel and TSMC, CFETs, and ...

For example, there is more than one way to move data across a fixed distance. In some cases, this could involve a pre-built, ...

It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second ...

Comprehensive testing is needed to ensure that chiplet systems can withstand extreme conditions.

Efficiently connecting the multiple CPUs and accelerators, various switches, and numerous NICs in modern data centers.

SE: Product and technology cycles are accelerating to the point where it may not even be useful to do a post-mortem because ...

As the demand for AI and machine learning accelerates, the need for faster and more flexible data interconnects has never ...

Shift left requires abstractions on which early analysis can be performed. For architectural analysis, abstractions are ...

As computational capabilities continue to evolve, integrating advanced grid interpolation techniques like the dual-grid ...

The LLM component of multimodal models has the same general transformer architecture. The connector in LLaVA is a ...

The surge in data-rich applications shows no signs of slowing down, fueling significant evolution within the global ...

Increasingly complex and heterogeneous architectures, coupled with the adoption of high-performance materials, are making it ...