(Nanowerk News) Silicon-based electronics are approaching their physical limitations and new materials are needed to keep up with current technological demands. Two-dimensional (2D) materials have a ...
A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
We present a review of our recent research on the formation of two-dimensional (2D) nanopatterns via self-assembly and their transformations by external stimuli. The proper design and synthesis of ...
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