In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...
The stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by 1-fold, SiC power modules allow for ...
In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s ...
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