Launched in 2021 with a Rs 76,000-crore outlay, the India Semiconductor Mission was conceived as a state-backed push to build ...

India has laid the foundation for its first advanced 3D chip packaging plant in Odisha, which is a key step in building a ...

India announces its first 3D semiconductor packaging unit in Odisha, boosting AI, 5G and defence manufacturing ambitions!

In a significant step towards building a domestic semiconductor ecosystem, the Ministry of Electronics and IT on Saturday ...

Odisha's CM laid the foundation for India's first glass substrate chip packaging unit, advancing local semiconductor ...

Moving past fabrication focus, India explores advanced packaging where stacking, integration, and materials innovation begin ...

The project is being implemented by the US-based 3D Glass Solutions Inc through its wholly owned Indian subsidiary ...

Odisha poised to power PM Modi’s vision of making India self-reliant in semiconductor and electronics manufacturing: Chief ...

Odisha's upcoming 3D semiconductor chip plant has secured bookings even before construction begins, indicating strong early ...

The total investment in the project is Rs 1,943.53 crore, including approved Central fiscal support of Rs 799 crore and additional state support of approximately Rs 399.5 crore.

India’s push to build a robust domestic semiconductor ecosystem took a significant step forward with the foundation of its ...

The foundation stone for the first advanced 3D semiconductor packaging unit in India has been laid at Info Valley in ...